Our gap filling, thermal management product line consists of multiple product families.

Our thermal management materials have been engineered to provide an effective thermal interface between heat sinks and electronic devices.

Our thicker, thermally conductive, gap filling materials are available in thicknesses ranging from .010″ to .250″. Engineers have specified our advanced gap filling materials to help eliminate air gaps between heat generating devices and a chassis.

The versatile gap filler material may also be used in heat pipe assemblies, signal amplifiers and even as a vibration isolation material. Engineers have even used our gap filler to completely eliminate the use of cooling fans in electronic enclosures.

Western Rubber & Supply, Inc. also sells thinner thermal management products. The thinner materials are typically used as an interface between a power transistor, CPU or other heat-generating component and a heat sink or rail. Our materials provide engineers with a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications.

As an added convenience, Western Rubber & Supply, Inc. is able to supply custom-cut pads to your specification.

Most materials are available with or without adhesive on one side.

WESTERN RUBBER & SUPPLY INC THERMAL BROCHURE REV 11-30-09